3D heterogeneous integrated monolayer graphene Si-CMOS RF gas sensor platform

M. Holt, S. M. Mortazavi Zanjani, M. M. Sadeghi, D. Akinwande

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    We report the first monolithically integrated CMOS-monolayer graphene gas sensor, with a minimal number of essential post-CMOS processing steps, demonstrating a platform technology that enables integration of nascent two-dimensional materials with the low latency, low power and cost advantages of silicon CMOS (Si-CMOS) platform. Heterogeneous integration of Si-CMOS and two-dimensional materials such as monolayer graphene is a step toward enabling future mobile sensor networks for the Internet of Things (IoT) and achieving more-than-Moore (MtM) scaling. The graphene integration presented here addresses considerable barriers to heterogeneous integration with Si-CMOS, namely post-CMOS process parameters such as temperature and material limits, and the low-power requirements of untethered sensors in general. A co-designed driving circuit in mature 0.18 μm Si-CMOS foundry technology provides the foundation for directly integrated graphene chemiresistive junctions in a radio frequency (RF) wireless-enabled circuit platform.

    LanguageEnglish (US)
    Title of host publication2017 IEEE International Electron Devices Meeting, IEDM 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages18.5.1-18.5.4
    ISBN (Electronic)9781538635599
    DOIs
    StatePublished - Jan 23 2018
    Event63rd IEEE International Electron Devices Meeting, IEDM 2017 - San Francisco, United States
    Duration: Dec 2 2017Dec 6 2017

    Other

    Other63rd IEEE International Electron Devices Meeting, IEDM 2017
    CountryUnited States
    CitySan Francisco
    Period12/2/1712/6/17

    Fingerprint

    Graphite
    Silicon
    Chemical sensors
    Graphene
    Monolayers
    CMOS
    radio frequencies
    graphene
    platforms
    sensors
    silicon
    gases
    Networks (circuits)
    Foundries
    Sensor networks
    Wireless networks
    foundries
    Sensors
    Processing
    Costs

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

    Cite this

    Holt, M., Mortazavi Zanjani, S. M., Sadeghi, M. M., & Akinwande, D. (2018). 3D heterogeneous integrated monolayer graphene Si-CMOS RF gas sensor platform. In 2017 IEEE International Electron Devices Meeting, IEDM 2017 (pp. 18.5.1-18.5.4). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM.2017.8268417

    3D heterogeneous integrated monolayer graphene Si-CMOS RF gas sensor platform. / Holt, M.; Mortazavi Zanjani, S. M.; Sadeghi, M. M.; Akinwande, D.

    2017 IEEE International Electron Devices Meeting, IEDM 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 18.5.1-18.5.4.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Holt, M, Mortazavi Zanjani, SM, Sadeghi, MM & Akinwande, D 2018, 3D heterogeneous integrated monolayer graphene Si-CMOS RF gas sensor platform. in 2017 IEEE International Electron Devices Meeting, IEDM 2017. Institute of Electrical and Electronics Engineers Inc., pp. 18.5.1-18.5.4, 63rd IEEE International Electron Devices Meeting, IEDM 2017, San Francisco, United States, 12/2/17. https://doi.org/10.1109/IEDM.2017.8268417
    Holt M, Mortazavi Zanjani SM, Sadeghi MM, Akinwande D. 3D heterogeneous integrated monolayer graphene Si-CMOS RF gas sensor platform. In 2017 IEEE International Electron Devices Meeting, IEDM 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 18.5.1-18.5.4 https://doi.org/10.1109/IEDM.2017.8268417
    Holt, M. ; Mortazavi Zanjani, S. M. ; Sadeghi, M. M. ; Akinwande, D. / 3D heterogeneous integrated monolayer graphene Si-CMOS RF gas sensor platform. 2017 IEEE International Electron Devices Meeting, IEDM 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 18.5.1-18.5.4
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