A comprehensive study of the sintering of copper nanoparticles using femtosecond, nanosecond, and continuous wave lasers

Nilabh K. Roy, Obehi G. Dibua, William Jou, Feng He, Jihoon Jeong, Yaguo Wang, Michael Arthur Cullinan

    Research output: Contribution to journalArticle

    • 3 Citations

    Abstract

    A high electrical and thermal conductivity coupled with low costs make copper (Cu) an enticing alternative to aluminum for the fabrication of interconnects in packaging applications. To tap into the benefits of the ever-reducing size of transistors, it is required to increase the input/output pin count on electronic chips, and thus, minimize the size of chip to board interconnects. Laser sintering of Cu nanoparticle (NP) inks can serve as a promising process for developing these micron sized, 3D interconnect structures. However, the exact processing windows for Cu NP sintering are not well known. Therefore, this paper presents an extensive experimental investigation of the sintering processing window with different lasers including femtosecond (fs), nanosecond (ns), and continuous-wave (CW) lasers. The dependence of the processing window on Cu layer thicknesses and laser exposure durations has also been investigated. A simplified model to estimate optimum laser sintering windows for Cu NPs using pulsed lasers is presented and the predicted estimates are compared against the experimental results. Given the simplicity of the model, it is shown to provide good estimates for fluence required for the onset of sintering and the processing window for good sintering of Cu NPs.

    LanguageEnglish (US)
    Article number010903
    Pages1-21
    Number of pages21
    JournalJournal of Micro and Nano-Manufacturing
    Volume6
    Issue number1
    DOIs
    StatePublished - Mar 1 2018

    Fingerprint

    Continuous wave lasers
    Copper
    Sintering
    Nanoparticles
    Processing
    Lasers
    Ultrashort pulses
    Aluminum
    Pulsed lasers
    Ink
    Thermal conductivity
    Packaging
    Transistors
    Fabrication
    Costs

    ASJC Scopus subject areas

    • Mechanics of Materials
    • Process Chemistry and Technology
    • Industrial and Manufacturing Engineering

    Cite this

    A comprehensive study of the sintering of copper nanoparticles using femtosecond, nanosecond, and continuous wave lasers. / Roy, Nilabh K.; Dibua, Obehi G.; Jou, William; He, Feng; Jeong, Jihoon; Wang, Yaguo; Cullinan, Michael Arthur.

    In: Journal of Micro and Nano-Manufacturing, Vol. 6, No. 1, 010903, 01.03.2018, p. 1-21.

    Research output: Contribution to journalArticle

    Roy, Nilabh K. ; Dibua, Obehi G. ; Jou, William ; He, Feng ; Jeong, Jihoon ; Wang, Yaguo ; Cullinan, Michael Arthur. / A comprehensive study of the sintering of copper nanoparticles using femtosecond, nanosecond, and continuous wave lasers. In: Journal of Micro and Nano-Manufacturing. 2018 ; Vol. 6, No. 1. pp. 1-21.
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